2N Wire for Ultra Fine Pitch Wire Bonding: Challenges & Solutions

Author

June Sub Hwang ; Kumar, B. Suresh ; Jeong Tak Moon ; Chul Uhm ; Yu Na Kim ; Sivakumar, Mohandass ; Song Keng Yew, J.

Author_Institution

MK Electron Co., Ltd., Yongin, South Korea

fYear

2008

fDate

9-12 Dec. 2008

Firstpage

795

Lastpage

799

Abstract

Various Au bonding wires which have different diameters from 25 um to 12 um, and purity of 2N and 4N are used for studying possible problems in ultra fine wire bonding. As wire diameter gets finer, grain size gets finer and portion of <111> direction in wire texture is increased due to high working ratio. Moreover, as wire diameter gets finer, eccentricity of FAB (Free Air Ball) get worse and, for soft 4N wire, neck broken issue is occurred in 12 um bonding due to low neck strength, and for hard 2N wire, bond-off issue is occurred due to bad initial bondability. Also initial IMC (Intermetallics) coverage gets worse and HTST reliability is dramatically dropped in ultra fine wire application. Therefore, soft 2N wire which has relatively low FAB hardness and Pd-based dopant composition could be an alternative to solve these issues in ultra fine wire.

Keywords

gold; grain size; hardness; lead bonding; reliability; texture; 2N wire; Au; FAB hardness; dopant composition; free air ball eccentricity; grain size; low neck strength; size 25 mum to 12 mum; ultrafine pitch wire bonding; wire diameter; wire texture; Bonding; Casting; Electrons; Gold; Grain size; Intermetallic; Manufacturing processes; Neck; Size control; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th

Conference_Location

Singapore

Print_ISBN

978-1-4244-2117-6

Electronic_ISBN

978-1-4244-2118-3

Type

conf

DOI

10.1109/EPTC.2008.4763529

Filename

4763529