Thermal, Mechanical and Optical Analysis of SiC-based LED

Reliability is one of the important problems in electronic packaging, which affects the use and life of the products. In this paper, we present a high power SiC-based light-emitting diode (LED), the thermal, mechanical and optical performances were investigated respectively. Heat dissipation performance and junction temperature were obtained using finite element analysis (FEA), the influences were analyzed on the temperature of the chip with different power input and convection coefficient, mechanical characteristics were researched by its thermal stress; optical properties were simulated using optical analysis software and experiment. The results show that the maximal temperature which appears in the chip is about 93°C; the thermal resistance in the package is found to be 8.73°C /W; great thermal stress lies between chip and silver epoxy, which will depress the reliability of the LED, its optical properties can be improved by second optical design. The luminous flux, efficacy and color coordinates will change with the increase of current.