DocumentCode
2519992
Title
Design for manufacturability in submicron domain
Author
Maly, W. ; Heineken, H. ; Khare, J. ; Nag, P.K.
Author_Institution
Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
fYear
1996
fDate
10-14 Nov. 1996
Firstpage
690
Lastpage
697
Abstract
Key characteristics of newly emerging IC technologies render the traditional concept of die size minimization and traditional "design rules" insufficient to handle the design-manufacturing interface. This tutorial surveys the design and process characteristics relevant to the manufacturability of submicron ICs. The discussion also covers analysis of design for manufacturability (DFM) trade-offs. Yield and cost models needed to analyze these trade-offs are explained as well.
Keywords
design for manufacture; integrated circuit technology; integrated circuit yield; IC technologies; cost model; design for manufacturability; design rules; die size minimization; submicron domain; trade-offs; yield; Algorithm design and analysis; Circuit optimization; Cost function; Design for manufacture; Manufacturing processes; Minimization; Physics; Process design; Rendering (computer graphics); Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer-Aided Design, 1996. ICCAD-96. Digest of Technical Papers., 1996 IEEE/ACM International Conference on
Conference_Location
San Jose, CA, USA
Print_ISBN
0-8186-7597-7
Type
conf
DOI
10.1109/ICCAD.1996.571365
Filename
571365
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