The Whisker Mitigation Efficiency of Ni Underlayer for IC Packaging on Board

Author

Lee, Jeffrey ChangBing

Author_Institution

IST-Integrated Service Technol. Inc., Hsin-chu

fYear

2008

fDate

9-12 Dec. 2008

Firstpage

1060

Lastpage

1065

Abstract

In the study, the Ni underlayer plus matt Sn plated packages in PLCC, PDIP and LQFP were subject to SnAgCu and SnPb surface mounting and wave soldering respectively on the PCB with OSP surface finish, then followed by TCT (-55degC to 85degC) 1000 cycle, THT (60degC/90%RH) 3000 hrs to investigate whisker growth propensity. The practical whisker performance confirmation on the PCB beyond reflow simulation and component level was concluded to understand lin term of Ni underlayer efficiency Ad. dtithSionnally, varpiotous SSnnthtihickness over Ni layer in package level was also applied to explore the Sn thickness effect on the whisker groovwethr TCT.

Keywords

copper alloys; integrated circuit packaging; lead alloys; nickel; silver alloys; surface mount technology; tin; tin alloys; whiskers (crystal); IC packaging on board; Ni underlayer; Ni-Sn; SnAgCu; SnPb; matt Sn plating; reflow simulation; surface mounting; temperature 55 degC to 85 degC; wave soldering; whisker growth; whisker mitigation efficiency; Electronics packaging; Environmentally friendly manufacturing techniques; Integrated circuit packaging; Lead; Packaging machines; Soldering; Surface morphology; Surface waves; Testing; Tin; Matt Sn plating; Ni underlayer; Surface mounting; TCT; THT; Whisker;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th

Conference_Location

Singapore

Print_ISBN

978-1-4244-2117-6

Electronic_ISBN

978-1-4244-2118-3

Type

conf

DOI

10.1109/EPTC.2008.4763570

Filename

4763570