DocumentCode
2520232
Title
Good resonance operating stabilities of piezoelectric SAW device structures using special perturbed multi-variable thermo-electromechanical finite element
Author
Zhang, W. ; Shi, L.Y. ; Wu, Z.H.
Author_Institution
Dept. of Civil Eng., Zhejiang Univ., Hangzhou, China
fYear
2002
fDate
2002
Firstpage
78
Lastpage
84
Abstract
Several highly nonlinear relations between disturbed surface acoustic wave (DSAW) and piezoelectric surface mount stress (PSMS) properties, temperature changes and electrode heights are computationally discovered, and quantitatively determined using a special new and effective perturbed multivariable thermal piezoelectric generalized plane strain finite element method (GPS FEM) with well-based shift and element static-condensation by improving plate element accuracies, in order to establish operating stabilities and design various potential high quality SAW resonating devices. Through executing the new codes on PC and Unix platforms, some new exclusive and fundamental results are included and provided.
Keywords
electrodes; electronic engineering computing; finite element analysis; perturbation techniques; piezoelectricity; stability; surface acoustic wave resonators; DSAW properties; GPS FEM; PC platforms; PSMS properties; SAW resonating devices; Unix platforms; disturbed surface acoustic wave properties; electrode heights; element static-condensation; nonlinear relations; operating stability; perturbation; perturbed multivariable thermal piezoelectric generalized plane strain FEM; piezoelectric SAW device structures; piezoelectric surface mount stress properties; plate element accuracy; resonance operating stability; special perturbed multi-variable thermo-electromechanical finite element method; temperature changes; Acoustic waves; Capacitive sensors; Electrodes; Finite element methods; Piezoelectric devices; Resonance; Surface acoustic wave devices; Temperature; Thermal stability; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Frequency Control Symposium and PDA Exhibition, 2002. IEEE International
Print_ISBN
0-7803-7082-1
Type
conf
DOI
10.1109/FREQ.2002.1075861
Filename
1075861
Link To Document