Development of Performance Characterization Methods for Optoelectronic Circuit Boards

Author

Chandrappan, Jayakrishnan ; Kuruveettil, Haridas ; Wei, Tan Chee ; Liang, Calvin Teo Wei ; Ramana, Pamidighantam V. ; Suzuki, Kenji ; Shioda, Tsiyoshi ; Lau, John

Author_Institution

Inst. of Microelectron., A STAR, Singapore, Singapore

fYear

2008

fDate

9-12 Dec. 2008

Firstpage

1108

Lastpage

1113

Abstract

In this paper, we illustrate the performance evaluation methods for optoelectronic circuit boards (OECBs). Here we report the details of the evaluation techniques for a bidirectional OECB developed to operate at 10 Gbps using a flip chip SMT optical transceiver. The evaluation techniques include DC and high speed optical characterization of individual component as well as at interconnect level. Performance evaluation of optical waveguide, optical DC characterization of VCSEL and photo diode, high speed optical characterization of transmitter, receiver and optical link are described here in detail.

Keywords

flip-chip devices; integrated optoelectronics; optical interconnections; optical links; optical receivers; optical transmitters; optical waveguides; photodiodes; printed circuits; surface emitting lasers; surface mount technology; transceivers; VCSEL; bidirectional OECB; flip chip SMT optical transceiver; interconnect; optical link; optical waveguide; optoelectronic circuit boards; performance evaluation; photodiode; receiver; transmitter; Flip chip; High speed optical techniques; Optical devices; Optical interconnections; Optical receivers; Optical transmitters; Optical waveguides; Printed circuits; Surface-mount technology; Transceivers;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th

Conference_Location

Singapore

Print_ISBN

978-1-4244-2117-6

Electronic_ISBN

978-1-4244-2118-3

Type

conf

DOI

10.1109/EPTC.2008.4763577

Filename

4763577