• DocumentCode
    2520341
  • Title

    Indirect compensation technique based two-stage recycling folded cascode amplifier for reconfigurable multi-mode sigma-delta ADC

  • Author

    Fahmy, Ghazal A. ; Pokharel, R.K. ; Kanaya, H. ; Yoshida, K.

  • Author_Institution
    Grad. Sch. of Inf. Sci. & Electr. Eng., Kyushu Univ., Fukuoka, Japan
  • fYear
    2010
  • fDate
    15-17 Dec. 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Typical and proposed recycling folded cascade (RFC) amplifier have been designed in TSMC 0.18 μm. Simulated and measured results are compared. Proposed RFC demonstrate an enhancement on DC gain by 5 dB almost for the same power consumption and bandwidth. Moreover, it realized less input referred noise than typical. Split-length devices (SLD) method is applied on proposed (RFC) to create a low impedance node employed in indirect feedback compensation. Realization of two-stages recycling folded cascade amplifier using indirect feedback compensation method has been designed. The proposed two-stages amplifier delivers open loop gain 83 dB enhanced by 20 dB over typical one, gain bandwidth product is 187 MHz and slew rate is 74 V/μs which is required for reconfigurable multi-mode sigma-delta ADC to attain high SNR and SNDR.
  • Keywords
    bandwidth allocation; circuit feedback; compensation; low-power electronics; operational amplifiers; sigma-delta modulation; DC gain; RFC amplifier; SLD method; SNDR; SNR; TSMC; bandwidth; indirect compensation technique; indirect feedback compensation; input referred noise; low impedance node; open loop gain; power consumption; reconfigurable multimode sigma-delta ADC; split-length devices method; two-stage recycling folded cascode amplifier; Bandwidth; Impedance; Integrated circuit modeling; MOS devices; Noise; Recycling; Superluminescent diodes; Folded cascode amplifier; Indirect compensation; split-length device;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices and Solid-State Circuits (EDSSC), 2010 IEEE International Conference of
  • Conference_Location
    Hong Kong
  • Print_ISBN
    978-1-4244-9997-7
  • Type

    conf

  • DOI
    10.1109/EDSSC.2010.5713690
  • Filename
    5713690