Title :
Electrical Interconnect Design Optimization for Fully Embedded Board-level Optical Interconnects
Author :
Chai, Joey Yi Yoon ; Yap, Guan Jie ; Lim, Teck Guan ; Tan, Chee Wei ; Khoo, Yee Mong ; Teo, Calvin Wei Liang ; Lim, Li Shiah ; Yee, Hong Lor ; Ramana, P.V. ; Lau, John ; Chang, Raymond ; Tang, Tom ; Chang, Henry ; Chiang, Steve ; Cheng, David ; Tseng, T.J
Author_Institution :
Inst. of Microelectron., Singapore, Singapore
Abstract :
Optical interconnect on printed circuit board are promising for backplane and motherboard applications due to their low propagation loss and high data-transfer density as an alternative to electrical interconnections which fail to meet the increasing data rate equipment. The advantages of embedded polymer waveguide as optical interconnects is the potential compatibility with the current PCB manufacturing process facilitating a smooth technological transfer from electrical to optical interconnects on PCB. In this manuscript, we report on the electrical design, design constraints, layout optimization and challenges in realizing a polymer waveguide embedded in a multi layer printed circuit board (PCB) for high speed applications.
Keywords :
assembling; integrated optoelectronics; optical interconnections; optical waveguides; optimisation; polymers; printed circuit layout; printed circuits; PCB; assembly; backplane; electrical interconnect design; embedded polymer waveguide; layout optimization; multi layer printed circuit board; optical interconnect; Backplanes; Constraint optimization; Design optimization; Integrated circuit interconnections; Manufacturing processes; Optical interconnections; Optical polymers; Optical waveguides; Printed circuits; Propagation losses;
Conference_Titel :
Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-2117-6
Electronic_ISBN :
978-1-4244-2118-3
DOI :
10.1109/EPTC.2008.4763580