Characterisation, modelling and design of bond-wire interconnects for chip-package co-design

This work is a comprehensive experimental investigation of chip to package wirebond interconnects for chip-package co-design. Wirebonds are interconnect bottlenecks in RF design, but are difficult to avoid due to their low cost and manufacturing case. We have shown measurements on wirebonds in coplanar configuration with different return paths and also the cross coupling. We have also extracted lumped and distributed models and demonstrate the excellent agreement with measurements at least up to 15GHz. We have proposed multi-wirebonds as a potential solution for better impedance matching. Different types of inductors with Q-factors of up to 100 have also been illustrated. We show influence of encapsulant on wirebonds and finally we also demonstrate a methodology to extract the time-domain response from S-parameters.