System-on-Package (SOP) architectures for compact and low cost RF front-end modules

Author

Pinel, S. ; Lim, K. ; DeJean, R.G. ; Li, L. ; Lee, C.-H. ; Maeng, M. ; Davis, M.F. ; Tentzeris, M. ; Laskar, J.

Author_Institution

Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

Volume

1

fYear

2003

fDate

7-9 Oct. 2003

Firstpage

307

Abstract

This paper presents the development of advanced System-on-Package (SOP) architectures for compact and low cost wireless RF systems. We present the design of compact stacked patch antennas using SHS structures for LMDS and V-band applications. Multi-layer organic packaging development for SOP is reported. An Intelligent Network Communicator (INC) RF block is presented as example of the high performances of multi-layer organic package. A novel ultra-compact 3D integration technology for SOP-based solutions is proposed and utilized for the implementation of a Ku band VCO module. In addition, the fabrication of very high Q-factor inductors in Liquid Crystal Polymer multi-layer substrate demonstrate superior performances compared to any other multilayer organic packages.

Keywords

Q-factor; inductors; microstrip antennas; multichip modules; power combiners; transceivers; voltage-controlled oscillators; Ku band VCO module; LMDS; RF front-end modules; V-band; advanced system-on-package architectures; compact low cost wireless systems; frequency characteristic; high Q-factor inductors; intelligent network communicator block; microstrip patch antennas; modified MCM-D technology; multilayer organic package; soft-and-hard surface; stacked patch antennas; ultracompact 3D integration technology; Costs; Fabrication; Inductors; Intelligent networks; Liquid crystal polymers; Packaging; Patch antennas; Q factor; Radio frequency; Voltage-controlled oscillators;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference, 2003. 33rd European

Print_ISBN

1-58053-834-7

Type

conf

DOI

10.1109/EUMC.2003.1262280

Filename

1262280