Development of Optical Subassembly for Plastic Optical Fiber in High Speed Applications

Author

Jing, Zhang ; Ramana, Pamidighantam V. ; Chandrappan, Jayakrishnan ; Wei, Tan Chee ; Yoon, Chai Yi ; Liang, Teo Wei ; Lau, John H. ; Gomex, Philbert Oliver ; Ting, Wang ; Ramkumar, V.M.

Author_Institution

Inst. of Microelectron., A STAR (Agency for Sci. Technol. & Res.), Singapore, Singapore

fYear

2008

fDate

9-12 Dec. 2008

Firstpage

1220

Lastpage

1225

Abstract

A low cost optical sub-assembly design for large core fiber is presented. The full module is realized by assembling the low cost optical sub-assembly directly on the functional PCB. -7dBm optical power output and 6 dB extinction ratio are achieved at transmitter by the vertical self-alignment and horizontal passive alignment. 190 m link distance is achieved at 2.5 Gbps and 340 m link distance is achieved at 1.25 Gbps for the transmitter with grade index plastic optical fiber.

Keywords

assembling; gradient index optics; integrated optoelectronics; modules; optical fibre communication; optical links; optical transmitters; plastics; printed circuits; PCB; assembling; bit rate 1.25 Gbit/s; bit rate 2.5 Gbit/s; distance 340 m; extinction ratio; full module; grade index plastic optical fiber; horizontal passive alignment; optical power output; optical sub-assembly design; transmitter; vertical self-alignment; Assembly; Biomedical optical imaging; Costs; High speed optical techniques; Optical fiber devices; Optical fibers; Optical receivers; Optical transmitters; Plastics; Transceivers; Optical subassembly; high speed; low cost package; plastic optical fiber;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th

Conference_Location

Singapore

Print_ISBN

978-1-4244-2117-6

Electronic_ISBN

978-1-4244-2118-3

Type

conf

DOI

10.1109/EPTC.2008.4763596

Filename

4763596