DocumentCode
2520810
Title
RDF effect induced by source/drain doping in nano-scale UTB SOI MOSFET with nominally un-doped channel
Author
Du, Linfeng ; Zhang, Shengdong
Author_Institution
Shenzhen Grad. Sch., Peking Univ., Shenzhen, China
fYear
2010
fDate
15-17 Dec. 2010
Firstpage
1
Lastpage
4
Abstract
SOI MOSFETs with un-doped channel are generally considered immune to random dopant fluctuation (RDF) effect. However in ultra-small MOSFETs, the lateral extension distribution of source/drain (S/D) impurity can make the “nominally” un-doped channel considerably doped, thus very likely resulting in an unexpected noticeable RDF effect. In this work, we investigate the unexpected RDF effect in UTB SOI MOSFETs with un-doped channel by device simulation. Results show that, for sub-20nm gate length devices, the S/D doping abruptness (δ) is required to be around 1 nm/dec to have an acceptable Vth variation caused by the unexpected RDF effect. This requirement seems too difficult to meet in the present or near future technologies. A new limit to scaling nano-scale SOI devices is thus revealed.
Keywords
MOSFET; circuit simulation; semiconductor doping; silicon-on-insulator; gate length device; lateral extension distribution; nanoscale ultrathin body silicon-on-insulator MOSFET device; nominal undoped channel; random dopant fluctuation effect; size 20 nm; source-drain doping; Doping; Electron devices; Fluctuations; Impurities; Resource description framework; Semiconductor process modeling; Threshold voltage; Random Dopant Fluctuation (RDF); Source/Drain Doping; UTB SOI; Vt Variation;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices and Solid-State Circuits (EDSSC), 2010 IEEE International Conference of
Conference_Location
Hong Kong
Print_ISBN
978-1-4244-9997-7
Type
conf
DOI
10.1109/EDSSC.2010.5713715
Filename
5713715
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