DocumentCode
2520839
Title
Dicing Saw Process Study on Wafer Which Has Thick Aluminum Pads on the Scribe Street
Author
Luo, JunHua ; Li, Ting ; Yao, Jinzhong
Author_Institution
Freescale Semicond. (China) Ltd., Tianjin, China
fYear
2008
fDate
9-12 Dec. 2008
Firstpage
1253
Lastpage
1257
Abstract
In this paper, dicing saw process on the wafer has thick Aluminum pads on the scribe street is studied. Thick Aluminum pads wafer has bad topside chipping at Aluminum pads and the chipping out of specification limit is about 3.0%. New blade and dicing saw process are introduced to solve this issue. According the evaluation results, optimized recipe can solve the bad topside chipping on the Aluminum pads and the yield loss is zero. Backside chipping and blade life also are evaluated to ensure without additional cost.
Keywords
aluminium; sawing; semiconductor technology; Al; backside chipping; blade life; dicing saw process; scribe street; thick aluminum pads; topside chipping; yield loss; Aluminum; Blades; Costs; Delamination; Inspection; Production; Silicon; Size control; Thickness control; Wafer bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th
Conference_Location
Singapore
Print_ISBN
978-1-4244-2117-6
Electronic_ISBN
978-1-4244-2118-3
Type
conf
DOI
10.1109/EPTC.2008.4763602
Filename
4763602
Link To Document