• DocumentCode
    25209
  • Title

    Atomic Level Modeling of Extremely Thin Silicon-on-Insulator MOSFETs Including the Silicon Dioxide: Electronic Structure

  • Author

    Markov, Stanislav ; Aradi, Balint ; Chi-Yung Yam ; Hang Xie ; Frauenheim, Thomas ; GuanHua Chen

  • Author_Institution
    Dept. of Chem., Univ. of Hong Kong, Hong Kong, China
  • Volume
    62
  • Issue
    3
  • fYear
    2015
  • fDate
    Mar-15
  • Firstpage
    696
  • Lastpage
    704
  • Abstract
    Ultimate scaling of Si MOSFETs leads to extremely thin and short channels, which are justifiably modeled at the atomic level. Currently, hydrogen passivation of the channel is used in device models, as a compromise between efficiency and accuracy. This paper advances the state of the art by adopting a density-functional tight-binding Hamiltonian, permitting the inclusion of the confining amorphous oxide explicitly in the simulation domain in a way similar to ab initio approaches. Band structure of silicon-on-insulator films of different thicknesses is studied with this method, showing good agreement with the experiment and revealing large quantitative differences in comparison with simulations of H-passivated Si film.
  • Keywords
    MOSFET; elemental semiconductors; inclusions; passivation; semiconductor device models; silicon; silicon compounds; silicon-on-insulator; thin film transistors; Si-SiO2; ab initio approach; amorphous oxide; atomic level modeling; band structure; density-functional tight-binding Hamiltonian; electronic structure; extremely thin short channel; extremely thin silicon-on-insulator MOSFET; hydrogen passivation; inclusion; silicon-on-insulator film; Chemical elements; Computational modeling; Discrete Fourier transforms; MOSFET; Photonic band gap; Silicon; Silicon-on-insulator; Atomistic modeling; band structure; density-functional tight binding (DFTB); oxide interface; silicon on insulator (SOI); silicon on insulator (SOI).;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2014.2387288
  • Filename
    7014245