C2W bonding method for MEMS applications

Author

Chen Wei Sheng, K. ; Premachandran, C.S. ; Kyoung, Choi Won ; Ling, Ong Siong Chiew Xie ; Ratmin, Ahmad Khairyanto Bin ; Pa, Myo Ei Pa ; Lau, John

Author_Institution

Inst. of Microelectron., A STAR (Agency for Sci., Nanyang, Singapore

fYear

2008

fDate

9-12 Dec. 2008

Firstpage

1283

Lastpage

1287

Abstract

A low temperature C2W (Chip to wafer) bonding method is developed for integrating MEMS and electronics into a wafer level package. The diced known good MEMS chip is picked and bonded onto an ASIC wafer using an In based low temperature solder below 200 degC. The C2W bonded MEMS and ASIC wafer is sealed with a cap wafer. The sealed package is characterized for hermeticity and shear strength and found to meet the minimum requirements for a good sealing and bonding.

Keywords

application specific integrated circuits; micromechanical devices; shear strength; solders; wafer bonding; wafer level packaging; ASIC wafer; MEMS; chip-to-wafer bonding; low temperature solder; sealed package; shear strength; wafer level package; Application specific integrated circuits; Bonding processes; Consumer electronics; Electronics packaging; Integrated circuit interconnections; Integrated circuit technology; Microelectromechanical devices; Micromechanical devices; Temperature; Wafer bonding;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th

Conference_Location

Singapore

Print_ISBN

978-1-4244-2117-6

Electronic_ISBN

978-1-4244-2118-3

Type

conf

DOI

10.1109/EPTC.2008.4763607

Filename

4763607