• DocumentCode
    252102
  • Title

    A fast fabricating electro-wetting platform to implement large droplet manipulation

  • Author

    Yiyan Li ; Chen, Ru Shan ; Baker, R. Jacob

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Nevada, Las Vegas, NV, USA
  • fYear
    2014
  • fDate
    3-6 Aug. 2014
  • Firstpage
    326
  • Lastpage
    329
  • Abstract
    Droplet actuation, merging, and splitting using controlled electro-wetting are implemented on the top of a standard printed circuit board (PCB) resulting in a fast prototyping microfluidic platform for biological experiments. In the system reported here the PCB is used as a substrate and is covered with Saran Wrap. The Saran Wrap can then be coated, or not, with a commercial water repellent liquid. The resulting hydrophobic surface is used as a supporting dielectric layer for the experiments. Results show that lower actuation voltages and frequencies are achieved, than previously reported, to move larger droplets (30 microliter). Single-plate and dual-plate techniques are compared showing that a single-plate system can utilize lower voltages while at the same time being simpler to construct. The platform is designed for tissue immunohistochemistry staining experiments.
  • Keywords
    bioMEMS; drops; microfabrication; microfluidics; printed circuits; wetting; PCB; Saran wrap; biological experiments; controlled electro-wetting; dielectric layer; droplet actuation; droplet merging; droplet splitting; dual-plate techniques; fast fabricating electro-wetting platform; fast prototyping microfluidic platform; hydrophobic surface; large droplet manipulation; lower actuation voltages; single-plate techniques; standard printed circuit board; tissue immunohistochemistry staining experiments; water repellent liquid; Arrays; Electrodes; Immune system; Microfluidics; Standards; Substrates; Surface treatment; electro-wetting; immunohistochemistry; low voltage; printed circuit board (PCB) microfluidics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems (MWSCAS), 2014 IEEE 57th International Midwest Symposium on
  • Conference_Location
    College Station, TX
  • ISSN
    1548-3746
  • Print_ISBN
    978-1-4799-4134-6
  • Type

    conf

  • DOI
    10.1109/MWSCAS.2014.6908418
  • Filename
    6908418