Title :
Flip-chip STW filters and frequency trimming method
Author :
Yatsuda, H. ; Iijima, H. ; Yabe, K. ; Tsukuda, H. ; Shinohara, S.
Author_Institution :
Japan Radio Co. Ltd., Saitama, Japan
Abstract :
This paper describes 2.4 GHz and 3.5 GHz flip-chip narrow-band filters using surface transverse waves (STWs) on quartz for oscillator applications. A Q of about 1300 and insertion losses of 3 dB and 5 dB are achieved for 2.4 GHz and 3.5 GHz flip-chip STW filters, respectively. Also, oscillator characteristics using the flip-chip STW filters are presented. In addition, trimming methods for flip-chip STW filters are described. We have succeeded in frequency trimming using CF4 chemistry, in situ monitoring the center frequency for flip-chip STW filters with 3.2 mm×2.5 mm ceramic packages.
Keywords :
Q-factor; UHF filters; UHF oscillators; ceramic packaging; flip-chip devices; losses; microwave filters; microwave oscillators; surface acoustic wave resonator filters; 2.4 GHz; 2.5 mm; 3 dB; 3.2 mm; 3.5 GHz; 5 dB; CF4 chemistry frequency trimming; SAW filters; STW filters; UHF filters; UHF oscillators; carbon tetrafluoride; center frequency in situ monitoring; ceramic packages; flip-chip surface transverse wave filters; frequency trimming methods; high Q filters; insertion losses; microwave filters; microwave oscillators; oscillator characteristics; quartz; Ceramics; Chemistry; Filters; Frequency; Insertion loss; Monitoring; Narrowband; Oscillators; Packaging; Surface waves;
Conference_Titel :
Frequency Control Symposium and PDA Exhibition, 2002. IEEE International
Print_ISBN :
0-7803-7082-1
DOI :
10.1109/FREQ.2002.1075910