Effect of Impact Rate on the Strength of Lead-free Solder Joints

Author

Huang, L. ; Lin, K.L. ; Liu, D.S.

Author_Institution

Dept. of Mater. Sci. & Eng., Nat. Cheng Kung Univ., Tainan, Taiwan

fYear

2008

fDate

9-12 Dec. 2008

Firstpage

1369

Lastpage

1374

Abstract

The joint strength of Sn37Pb, Sn-lAg-0.5Cu (SAC105), Sn-3Ag-0.5Cu (SAC305) and Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga (SnZn-5e) solder joints on Au/Ni/Cu and OSP/Cu metallization were investigated with micro-impact test. All solder joints exhibit bulk and interfacial fracture modes except Sn37Pb of which fracture only occurs in the bulk. The impact resistance is governed by strain rate. Sn37Pb, SAC105 and SnZn-5e solder joints reveal a proportional correlation with respect to impact rate. SAC305 solder joint shows a maximum impact resistance at an impact rate of 650 mm/sec. The existence of maximum impact resistance is ascribed to the competition between bulk and interfacial fracture modes.

Keywords

copper; copper alloys; couplings; fracture; gallium alloys; gold; impact strength; lead alloys; metallisation; nickel; silver alloys; solders; tin alloys; zinc alloys; Au-Ni-Cu; SnAgCu; SnPb; SnZnAgGa; impact resistance; interfacial fracture modes; joint strength; lead-free solder joints; metallization; micro-impact test; Capacitive sensors; Copper alloys; Environmentally friendly manufacturing techniques; Lead; Optical microscopy; Packaging; Scanning electron microscopy; Soldering; Temperature; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th

Conference_Location

Singapore

Print_ISBN

978-1-4244-2117-6

Electronic_ISBN

978-1-4244-2118-3

Type

conf

DOI

10.1109/EPTC.2008.4763622

Filename

4763622