Title :
A novel readout circuit for on-sensor multispectral classification
Author :
Ghasemi, Javad ; Zarkesh-Ha, Payman ; Krishna, Sanjay ; Godoy, Sebastian E. ; Hayat, Majeed M.
Author_Institution :
ECE Dept., Univ. of New Mexico, Albuquerque, NM, USA
Abstract :
A new readout integrated circuit (ROIC) for multispectral classification is presented. The ROIC is designed to utilize the spectral response tunability of dot-in-a-well (DWELL) infrared photodetector to exploit the possibility of real-time on-chip multispectral imaging for classification in analog domain. The unit cells are designed to include all necessary elements needed for spectral classification, including high-voltage time-varying positive and negative biases, bipolar integration, and selective sample-and-hold circuits. A test chip was designed and fabricated using TSMC´s 0.35 μm high-voltage technology. The test chip has successfully completed its initial functional tests and is ready for hybridization to a DWELL focal-plane array.
Keywords :
CMOS analogue integrated circuits; CMOS image sensors; image classification; infrared detectors; readout electronics; DWELL focal-plane array; ROIC; TSMC high-voltage technology; analog domain classification; bipolar integration; dot-in-a-well infrared photodetector; for on-sensor multispectral classification; functional tests; high-voltage time-varying positive biases; negative biases; readout integrated circuit; real-time on-chip multispectral imaging; selective sample-and-hold circuits; size 0.35 mum; spectral response tunability; test chip; unit cells; Arrays; Capacitors; Decoding; Integrated circuits; Photoconductivity; Photodetectors; Rocks; CMOS image sensors; ROIC; Readout integrated circuit; multispectral classification; smart pixel;
Conference_Titel :
Circuits and Systems (MWSCAS), 2014 IEEE 57th International Midwest Symposium on
Conference_Location :
College Station, TX
Print_ISBN :
978-1-4799-4134-6
DOI :
10.1109/MWSCAS.2014.6908433