DocumentCode :
2521364
Title :
Phase change materials and random access memory
Author :
Song, Zhitang ; Rao, Feng ; Ling, Yun ; Wu, Liangcai ; Liu, Bo
Author_Institution :
Lab. of Nanotechnol., Chinese Acad. of Sci., Shanghai, China
fYear :
2010
fDate :
15-17 Dec. 2010
Firstpage :
1
Lastpage :
4
Abstract :
Shanghai institute of micro-system and information technology (SIMIT) began the research work in PCM technologies from 2003. This report will systematically introduce the recent progress of the PCM group led by Prof. Song. The main contents include: 1) the significance of R&D on PCM, 2) platform construction, 3) research on novel phase change materials like nano composite material (phase change material with dielectric material), multilayer phase change material, and buffer layers, 4) novel experimental methods on finding novel phase change materials like material library and high density PCM array fabrication using FIB platform, 5) phase change material engineer on 8-inch processing line, 6) theoretical simulation of 1R unit, driving device, circuit, and novel phase change materials, and 7) key technologies of developing PCM chips including diode process, nano electrode fabrication, Ge2Sb2Te5 (GST) hole filling and CMP, GST etch, and chip design and the latest test results.
Keywords :
phase change materials; phase change memories; random-access storage; FIB platform; GST etch; PCM technology; buffer layers; chip design; diode process; driving device; high density PCM array fabrication; hole filling; material library; multilayer phase change material; nanocomposite material; nanoelectrode fabrication; random access memory; CMOS integrated circuits; CMOS technology; Heating; Lead; Performance evaluation; Phase change materials; Phase change random access memory; phase change material; random access memory;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices and Solid-State Circuits (EDSSC), 2010 IEEE International Conference of
Conference_Location :
Hong Kong
Print_ISBN :
978-1-4244-9997-7
Type :
conf
DOI :
10.1109/EDSSC.2010.5713744
Filename :
5713744
Link To Document :
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