Title :
Material effects on the performance and reliability of high-power molded dual-in-line packages
Author :
DiOrio, Mark ; Pinamaneni, SubbaRao
Author_Institution :
Nat. Semicond. Corp., Santa Clara, CA, USA
Abstract :
Materials used in the packaging of high-power-dissipation molded dual-in-line packages (MDIPs) are investigated. The selection of the correct materials is based on a finite-element stress-analysis (FESA) model. The FESA results, which are used to compare various materials and their properties, are substantiated by experimental results. Chip or die cracking due to thermal stresses within the package caused by soldering is the failure mechanism on which this study is based and which is used to judge package materials are judged. The specific material systems addressed are: leadframe composition and thickness, silicon chip thickness, and die attach composition and thickness.<>
Keywords :
finite element analysis; integrated circuit technology; packaging; reliability; thermal stress cracking; FESA; MDIP; Si chip thickness; chip cracking; die attach composition; die cracking; die thickness; failure mechanism; finite element stress analysis model; leadframe composition; leadframe thickness; material selection; molded dual-in-line packages; power dissipation; soldering; thermal stresses; Composite materials; Failure analysis; Finite element methods; Lead; Materials reliability; Microassembly; Packaging; Silicon; Soldering; Thermal stresses;
Conference_Titel :
Electronics Components Conference, 1988., Proceedings of the 38th
Conference_Location :
Los Angeles, CA, USA
DOI :
10.1109/ECC.1988.12624
