DocumentCode :
2521748
Title :
Three-phase lewis-nielsen model for the thermal conductivity of polymer nanocomposites
Author :
Kochetov, R. ; Korobko, A.V. ; Andritsch, T. ; Morshuis, P.H.F. ; Picken, S.J. ; Smit, J.J.
Author_Institution :
Delft Univ. of Technol., Delft, Netherlands
fYear :
2011
fDate :
16-19 Oct. 2011
Firstpage :
338
Lastpage :
341
Abstract :
The thermal conductivity of polymer-based microcomposites has been investigated for a long time. The existing theories predict the thermal conductivity of the polymers filled with conventional sized microparticles quite well. Significant effort has been made in studying and developing of the thermal conductivity behavior of a relatively new class of composites, which contain nanosized filler. A considerable volume of the polymer matrix has a modified structure with respect to the bulk polymer due to polymer-filler bonding via a silane coupling agent (SCA), which has been applied used to improve the thermal contact between the individual components. The thermal conductivity of a nanocomposite depends on the interfacial layer, which can be defined as a transition layer between a host material and incorporated nanofiller, rather then the thermal conductivities of the constituents. A composite material can be represented by composite particles embedded into the polymer matrix. A composite particle consists of a nanoparticle and the polymer close to the particle surface, which is organized by the surface modification. We propose a model for the thermal conductivity of the polymer nanocomposites. This model is intended to be used for systems which consist of a polymer matrix, nanofiller and the interfacial layer around the nanoparticles which has different properties than the bulk polymer.
Keywords :
bonding processes; matrix algebra; nanocomposites; polymers; thermal conductivity; SCA; bulk polymer; conventional sized microparticle; host material; incorporated nanofiller; nanosized filler; polymer matrix; polymer nanocomposite; polymer-based microcomposite; polymer-filler bonding; silane coupling agent; thermal conductivity; three-phase Lewis-Nielsen model; Aluminum oxide; Conductivity; Erbium; Nanocomposites; Nanoparticles; Polymers; Thermal conductivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation and Dielectric Phenomena (CEIDP), 2011 Annual Report Conference on
Conference_Location :
Cancun
ISSN :
0084-9162
Print_ISBN :
978-1-4577-0985-2
Type :
conf
DOI :
10.1109/CEIDP.2011.6232665
Filename :
6232665
Link To Document :
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