• DocumentCode
    252194
  • Title

    An evaluation of 6T and 8T FinFET SRAM cell leakage currents

  • Author

    Turi, Michael A. ; Delgado-Frias, Jose G.

  • Author_Institution
    Dept. of Comput. Sci. & Comput. Eng., Pacific Lutheran Univ., Tacoma, WA, USA
  • fYear
    2014
  • fDate
    3-6 Aug. 2014
  • Firstpage
    523
  • Lastpage
    526
  • Abstract
    We present six- and eight-transistor (6T, 8T) FinFET SRAM cell schemes using shorted gate (SG) and low power (LP) FinFET configurations and comprehensively evaluate their leakage currents. FinFETs provide significantly lower leakage current and higher on-current than bulk-CMOS transistors and this allows 8T FinFET SRAM schemes to greatly outperform 8T 32nm CMOS SRAM cells. Reverse-biasing the back gates of the cross-coupled inverter FinFETs reduces leakage current by up to 97%; the largest reduction is obtained with n- and p-back gate biases of -0.2V and VDD+0.2 V, respectively. This reverse-biasing also minimizes leakage variation due to parameter and temperature variations. Leakage current and read speed are chiefly responsible for SRAM energy consumption. The 6T Low-Power FinFET scheme uses these configurations and has the lowest leakage; however, 8T SRAM schemes perform better than 6T SRAM schemes since leakage current can be reduced by low-power schemes that reverse-bias the cross-coupled inverter FinFET back gates without reducing read speed or read static noise margin. The 8T Low-Power Inverters (LP_INV) scheme has low leakage and performs best with an energy-delay product up to 60% less than the standard 8T Shorted Gate (SG) FinFET scheme and up to 62% less than the best-performing 6T FinFET scheme.
  • Keywords
    CMOS logic circuits; CMOS memory circuits; MOSFET circuits; SRAM chips; leakage currents; logic gates; low-power electronics; 6T FinFET SRAM cell leakage current evaluation; 8T FinFET SRAM cell leakage current evaluation; 8T low-power inverter scheme; 8T shorted gate FinFET scheme; CMOS SRAM cells; LP FinFET configurations; LP_INV scheme; SG; SRAM energy consumption; bulk-CMOS transistors; cross-coupled inverter FinFET back gates; energy-delay product; low power FinFET configurations; n-back gate biases; p-back gate biases; parameter variations; read speed reduction; read static noise margin; reverse-biasing; size 32 nm; temperature variations; voltage -0.2 V; voltage 0.2 V; FinFETs; Inverters; Leakage currents; Logic gates; SRAM cells;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems (MWSCAS), 2014 IEEE 57th International Midwest Symposium on
  • Conference_Location
    College Station, TX
  • ISSN
    1548-3746
  • Print_ISBN
    978-1-4799-4134-6
  • Type

    conf

  • DOI
    10.1109/MWSCAS.2014.6908467
  • Filename
    6908467