Characterization of multiconductor coupled lines from multiport TDR measurements

Author

Tripathi, A. ; Tripathi, V.K.

Author_Institution

Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR, USA

Volume

3

fYear

1997

fDate

8-13 June 1997

Firstpage

1777

Abstract

A new procedure to characterize nonuniform coupled multiconductor lines based on a one dimensional peeling algorithm is presented. The measured multiport reflection (scattering parameter) parameters in the time domain are used to construct piece-wise uniform configuration oriented models for multiple coupled lines. Examples of nonuniform two and three coupled striplines are included to illustrate the technique.

Keywords

S-parameters; deconvolution; electric admittance; microwave reflectometry; multiport networks; piecewise-linear techniques; strip lines; time-domain reflectometry; 1D deconvolution algorithms; multiconductor coupled lines; multiple coupled lines; multiport TDR measurements; multiport reflection parameters; nonuniform coupled multiconductor lines; nonuniform three coupled striplines; nonuniform two coupled striplines; one dimensional peeling algorithm; piece-wise uniform configuration oriented models; scattering parameter; time domain; Admittance; Coupling circuits; Data mining; Electric variables measurement; Multiconductor transmission lines; Reflection; Time measurement; Transmission line matrix methods; Transmission line measurements; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 1997., IEEE MTT-S International

Conference_Location

Denver, CO, USA

ISSN

0149-645X

Print_ISBN

0-7803-3814-6

Type

conf

DOI

10.1109/MWSYM.1997.596881

Filename

596881