Title :
Fabrication of high-performance, leaded, ceramic-chip carriers using a photoformable gold conductor
Author :
Roeder, P.J. ; Dorfman, J.R. ; Lantzer, T.D.
Author_Institution :
E.I. DuPont de Nemours & Co., Research Triangle Park, NC, USA
Abstract :
A photosensitive gold conductor was used to fabricate a high I/O
Keywords :
VLSI; ceramics; gold; integrated circuit technology; packaging; VLSI; lead attached strengths; leaded ceramic chip carrier; packaging; parallel-gap welding technique; photosensitive Au conductor; Bonding; Ceramics; Conducting materials; Conductors; Fabrication; Gold; Inorganic materials; Packaging; Very large scale integration; Wire;
Conference_Titel :
Electronics Components Conference, 1988., Proceedings of the 38th
Conference_Location :
Los Angeles, CA, USA
DOI :
10.1109/ECC.1988.12628
