DocumentCode
2522842
Title
Fabrication of high-performance, leaded, ceramic-chip carriers using a photoformable gold conductor
Author
Roeder, P.J. ; Dorfman, J.R. ; Lantzer, T.D.
Author_Institution
E.I. DuPont de Nemours & Co., Research Triangle Park, NC, USA
fYear
1988
fDate
9-11 May 1988
Firstpage
432
Lastpage
435
Abstract
A photosensitive gold conductor was used to fabricate a high I/O
Keywords
VLSI; ceramics; gold; integrated circuit technology; packaging; VLSI; lead attached strengths; leaded ceramic chip carrier; packaging; parallel-gap welding technique; photosensitive Au conductor; Bonding; Ceramics; Conducting materials; Conductors; Fabrication; Gold; Inorganic materials; Packaging; Very large scale integration; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Components Conference, 1988., Proceedings of the 38th
Conference_Location
Los Angeles, CA, USA
Type
conf
DOI
10.1109/ECC.1988.12628
Filename
12628
Link To Document