• DocumentCode
    2522967
  • Title

    An analogy for estimation of dielectric and mechanical strength of insulators at elevated temperature

  • Author

    Shkolnik, I.E. ; Hiziroglu, Huseyin R.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Kettering Univ., Flint, MI, USA
  • fYear
    2011
  • fDate
    16-19 Oct. 2011
  • Firstpage
    599
  • Lastpage
    602
  • Abstract
    Various types of insulators working at elevated temperatures provide combination of dielectric and mechanical strength. Based on kinetic nature of strength and nonlinear “stress-strain” dependency of solids, the paper presents an analytical analogy between electrical and mechanical strength as a function of temperature to bridge the gap between fundamental principles and the practical needs. In this study, in particular, polyimide films and polymer concrete insulators are used to describe the “strength-temperature” relationship and predict corresponding values of breakdown voltage. It is shown also the analogy between electrical and mechanical coefficients which determine the influence of structure, rate of loading on dielectric or mechanical strength of insulators. Obtained results are promising for predicting dielectric strength and time-to-failure of insulators by using their properties only at room temperature according to existing standards or experimental data.
  • Keywords
    electric breakdown; electric strength; polymer films; polymer insulators; reinforced concrete; stress-strain relations; tensile strength; breakdown voltage; electrical coefficients; electrical strength; elevated temperature; insulators dielectric strength estimation; insulators mechanical strength estimation; insulators time-to-failure; mechanical coefficients; nonlinear stress-strain dependency; polyimide films; polymer concrete insulators; strength kinetic nature; strength-temperature relationship; temperature 293 K to 298 K; Concrete; Dielectrics; Electric breakdown; Insulators; Polymers; Solids;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena (CEIDP), 2011 Annual Report Conference on
  • Conference_Location
    Cancun
  • ISSN
    0084-9162
  • Print_ISBN
    978-1-4577-0985-2
  • Type

    conf

  • DOI
    10.1109/CEIDP.2011.6232728
  • Filename
    6232728