• DocumentCode
    2523366
  • Title

    High thermal conductivity epoxy/BN composites with sufficient dielectric breakdown strength

  • Author

    Tanaka, Toshikatsu ; Wang, Zengbin ; Iizuka, Tomonori ; Kozako, Masahiro ; Ohki, Yoshimichi

  • Author_Institution
    IPS Res. Center, Waseda Univ., Kitakyushu, Japan
  • fYear
    2011
  • fDate
    16-19 Oct. 2011
  • Firstpage
    691
  • Lastpage
    694
  • Abstract
    Various types of epoxy/BN composites were prepared to optimize material conditions for high thermal conductivity and high breakdown strength. The best composite was found to be epoxy/conglomerated h-BN/nano silica nano micro composite with thermal conductivity 12 W/m·K and BD strength 15 kVpeak/0.2 mm. One of the most important factors to obtain high values of the two performances is to reduce void content. Surface treatment of fillers and nano filler addition are also useful.
  • Keywords
    electric breakdown; nanocomposites; thermal conductivity; conglomerated h-BN composite; filler surface treatment; high dielectric breakdown strength; high thermal conductivity BN composites; high thermal conductivity epoxy composites; nano filler addition; nano silica nano micro composite; void content reduction; Conductivity; Dielectric breakdown; Educational institutions; Materials; Silicon compounds; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena (CEIDP), 2011 Annual Report Conference on
  • Conference_Location
    Cancun
  • ISSN
    0084-9162
  • Print_ISBN
    978-1-4577-0985-2
  • Type

    conf

  • DOI
    10.1109/CEIDP.2011.6232750
  • Filename
    6232750
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2523366