DocumentCode :
2523366
Title :
High thermal conductivity epoxy/BN composites with sufficient dielectric breakdown strength
Author :
Tanaka, Toshikatsu ; Wang, Zengbin ; Iizuka, Tomonori ; Kozako, Masahiro ; Ohki, Yoshimichi
Author_Institution :
IPS Res. Center, Waseda Univ., Kitakyushu, Japan
fYear :
2011
fDate :
16-19 Oct. 2011
Firstpage :
691
Lastpage :
694
Abstract :
Various types of epoxy/BN composites were prepared to optimize material conditions for high thermal conductivity and high breakdown strength. The best composite was found to be epoxy/conglomerated h-BN/nano silica nano micro composite with thermal conductivity 12 W/m·K and BD strength 15 kVpeak/0.2 mm. One of the most important factors to obtain high values of the two performances is to reduce void content. Surface treatment of fillers and nano filler addition are also useful.
Keywords :
electric breakdown; nanocomposites; thermal conductivity; conglomerated h-BN composite; filler surface treatment; high dielectric breakdown strength; high thermal conductivity BN composites; high thermal conductivity epoxy composites; nano filler addition; nano silica nano micro composite; void content reduction; Conductivity; Dielectric breakdown; Educational institutions; Materials; Silicon compounds; Thermal conductivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation and Dielectric Phenomena (CEIDP), 2011 Annual Report Conference on
Conference_Location :
Cancun
ISSN :
0084-9162
Print_ISBN :
978-1-4577-0985-2
Type :
conf
DOI :
10.1109/CEIDP.2011.6232750
Filename :
6232750
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2523366
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