DocumentCode :
2523574
Title :
Measurement and modelling of the DC dielectric strength of pure, nanofilled and microfilled polyetherimide resin
Author :
Mary, D. ; Malec, D. ; Nguyen, M.Q. ; Werynski, P. ; Gornicka, B.
Author_Institution :
Laplace Lab., UPS, Toulouse, France
fYear :
2011
fDate :
16-19 Oct. 2011
Firstpage :
736
Lastpage :
739
Abstract :
Results of DC breakdown strength of pure, nanoscale-filled and microscale-filled PEI varnishes are described and analyzed in this communication. Silica (10nm and 400nm) has been used as a filler to increase the lifetime of such varnishes submitted to a partial discharge activity (varnish to be used in rotating machines fed by inverters). Experimental results have shown that both dielectric strength and conduction current are affected by the fillers. The higher the conduction current, the lower the DC breakdown strength. The modelling has consequently been focused on the thermal breakdown theory to explain these experimental data.
Keywords :
electric strength; partial discharges; polymer insulators; resins; silicone insulation; varnish; DC breakdown strength; DC dielectric strength; PEI varnish; conduction current; dielectric strength; microfilled polyetherimide resin; nanofilled polyetherimide resin; partial discharge activity; silica; thermal breakdown theory; Current measurement; Dielectric breakdown; Electrodes; Insulation; Mathematical model; Temperature measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation and Dielectric Phenomena (CEIDP), 2011 Annual Report Conference on
Conference_Location :
Cancun
ISSN :
0084-9162
Print_ISBN :
978-1-4577-0985-2
Type :
conf
DOI :
10.1109/CEIDP.2011.6232761
Filename :
6232761
Link To Document :
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