DocumentCode :
2523761
Title :
Via-aware global routing for good VLSI manufacturability and high yield
Author :
Yang, Yang ; Jing, Tong ; Hong, Xianlong ; Hu, Yu ; Zhu, Qi ; Hu, Xiaodong ; Yan, Guiying
Author_Institution :
Dept. of Comput. Sci. & Technol., Tsinghua Univ., Beijing, China
fYear :
2005
fDate :
23-25 July 2005
Firstpage :
198
Lastpage :
203
Abstract :
CAD tools have become more and more important for integrated circuit (IC) design since a complicated system can be designed into a single chip, called system-on-a-chip (SOC), in which physical design tool is an essential and critical part. We try to consider the via minimization problem as early as possible in physical design. We propose a routing method focusing on minimizing vias while considering mutability and wire-length constraint. That is, in the global routing phase, we minimize the number of bends, which is closely related to the number of vias. Previous work only dealt with very small nets, but our algorithm is general for the nets with any size. Experimental results show that our algorithm can greatly reduce the count of bends for various sizes of nets while meeting the constraints of congestion and wire-length.
Keywords :
VLSI; circuit CAD; design for manufacture; integrated circuit design; integrated circuit manufacture; integrated circuit yield; network routing; system-on-chip; CAD tool; VLSI manufacturability; congestion constraint; integrated circuit design; physical design tool; system-on-a-chip; via minimization problem; via-aware global routing; wire-length constraint; Circuit optimization; Computer aided manufacturing; Computer science; Content addressable storage; Design automation; Integrated circuit technology; Minimization; Routing; System-on-a-chip; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Application-Specific Systems, Architecture Processors, 2005. ASAP 2005. 16th IEEE International Conference on
ISSN :
2160-0511
Print_ISBN :
0-7695-2407-9
Type :
conf
DOI :
10.1109/ASAP.2005.67
Filename :
1540386
Link To Document :
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