Title :
A 0.5- mu m BiCMOS technology for logic and 4 Mbit-class SRAMs
Author :
Eklund, R. ; Chapman, R. ; Wei, C. ; Blanton, C. ; Holloway, T. ; Rodder, M. ; Graham, J. ; Terazawa, H. ; Rao, V. ; Tran, H. ; Suzuki, T. ; Havemann, R. ; Sundaresan, R. ; Scott, D. ; Haken, R.
Author_Institution :
Texas Instrum. Inc., Dallas, TX, USA
Abstract :
The authors describe a 0.5- mu m BiCMOS technology for high-performance logic and SRAMs (static RAMs) which is capable of supporting 5-V hot-carrier-hard circuit designs. In these designs the maximum drain-to-source voltage across a 0.5- mu m NMOS device is restricted to 4 V to ensure hot carrier reliability using 12-nm gate oxide. However, for the bipolar device, isolation and longer channel MOS devices, the process is required to support 5 V. For a 5-V supply voltage, the capacitive load drive factor for a BiCMOS NAND gate is 160 ps/pF, which is 30% smaller than the load drive factor for the same basic design gate built using an 0.8- mu m process with 20-nm gate oxide. The authors also discuss how a vertical NMOS driver transistor and a polysilicon PMOS load device are integrated into the 0.5- mu m BiCMOS process. The addition of these components permits a 23- mu m/sup 2/ stacked 6-T CMOS SRAM cell to be realized, suitable for 4-Mb-class BiCMOS SRAMs.<>
Keywords :
BIMOS integrated circuits; SRAM chips; integrated circuit technology; integrated logic circuits; integrated memory circuits; 0.5 micron; 4 Mbit; BiCMOS NAND gate; BiCMOS SRAMs; BiCMOS technology; CMOS SRAM cell; NMOS device; NMOS driver transistor; PMOS load device; SRAMs; basic design gate; bipolar device; drain-to-source voltage; high-performance logic; hot carrier reliability; hot-carrier-hard circuit designs; isolation; load drive factor; longer channel MOS devices; BiCMOS integrated circuits; Circuit synthesis; Driver circuits; Hot carriers; Isolation technology; Logic circuits; Logic design; Logic devices; MOS devices; Voltage;
Conference_Titel :
Electron Devices Meeting, 1989. IEDM '89. Technical Digest., International
Conference_Location :
Washington, DC, USA
Print_ISBN :
0-7803-0817-4
DOI :
10.1109/IEDM.1989.74313