DocumentCode :
2524040
Title :
On the advantages of serial architectures for low-power reliable computations
Author :
Beiu, V. ; Aunet, S. ; Nyathi, J. ; Rydberg, R.R., III ; Djupdal, A.
Author_Institution :
Sch. of EECS, Washington State Univ., Pullman, WA, USA
fYear :
2005
fDate :
23-25 July 2005
Firstpage :
276
Lastpage :
281
Abstract :
This paper explores low power reliable micro-architectures for addition. Power, speed, and reliability (both defect- and fault-tolerance) are important metrics of system design, spanning device, gate, block, and architectural levels. The analysis considers the low power needs of future systems at supply voltages comparable to threshold voltages (Vth). Theoretical analysis and simulations show a decline of the speed advantages of parallel adders when considering wire delays. These evaluations suggest that serial adders might do better for (ultra) low power operation, with redundancy for enhancing reliability. We analyze 32-bit multiplexed serial adders. The robustness when using output-wired mirrored adder (majority) gates is shown under faulty conditions. Simulations (at 180nm, 120 nm, and 70nm) identify the supply voltages where the power-delay and energy-delay products are minimized. These show that redundant serial adders are not only low power and reliable, but can trade speed for power in a wide range (by varying VDD both above and below Vth).
Keywords :
adders; circuit reliability; circuit simulation; low-power electronics; 120 nm; 180 nm; 70 nm; low power operation; low power reliable computation; low power reliable micro-architecture; multiplexed serial adders; parallel adders; redundant serial adders; serial architecture; theoretical analysis; threshold voltage; Analytical models; Computer architecture; Delay; Fault tolerant systems; Power system reliability; Redundancy; Robustness; System analysis and design; Threshold voltage; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Application-Specific Systems, Architecture Processors, 2005. ASAP 2005. 16th IEEE International Conference on
ISSN :
2160-0511
Print_ISBN :
0-7695-2407-9
Type :
conf
DOI :
10.1109/ASAP.2005.48
Filename :
1540397
Link To Document :
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