DocumentCode
2524400
Title
Testing a multichip package for a consumer communications application
Author
Biewenga, Alex ; Muris, Math ; Schuttert, Rodger ; Fawer, Urs
Author_Institution
Philips Electron. Design & Tools, Eindhoven, Netherlands
fYear
1998
fDate
18-23 Oct 1998
Firstpage
222
Lastpage
227
Abstract
A multichip package was developed to meet the market requirements for an advanced wireless telephone handset. The successful testing process of this multichip package, comprising test requirements, test strategy, test development and results from the production test is presented. A wireless telephone handset, containing the multichip package is currently in high volume production within Philips
Keywords
consumer electronics; cordless telephone systems; integrated circuit testing; mobile communication; multichip modules; production testing; telecommunication equipment testing; Philips; consumer communications; high volume production; multichip package; production test; test strategy; wireless telephone handset; Electronics packaging; Flash memory; Integrated circuit testing; Microprocessors; Production; Semiconductor device packaging; Software testing; Telephone sets; Telephony; Time to market;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 1998. Proceedings., International
Conference_Location
Washington, DC
ISSN
1089-3539
Print_ISBN
0-7803-5093-6
Type
conf
DOI
10.1109/TEST.1998.743155
Filename
743155
Link To Document