• DocumentCode
    2524514
  • Title

    Thermal behaviour of gate-less AlGaN/GaN heterostructures

  • Author

    Benbakhti, Brahim ; Rousseau, Michel ; Soltani, Ali ; Laureyns, Jacky ; De Jaeger, Jean Claude

  • Author_Institution
    Univ. des Sci. et Technol. de Lille, Villeneuve d´´Ascq
  • fYear
    2007
  • fDate
    8-10 Oct. 2007
  • Firstpage
    104
  • Lastpage
    107
  • Abstract
    For power applications, the dissipated power in GaN based devices becomes very significant and consequently can generate a very important self-heating effect in the component. The self-heating in the device increases considerably the lattice or the operating temperature and the transport properties are then degraded. To explain and to understand the physical phenomena observed in experiment for power components, it requires to introduce heating effects. The goal of this study is to estimate self-heating effects on the static characteristics of TLM (Transmission Line Model) AlGaN/GaN structures. For this objective, a developed physical thermal model is used in order to study the electrical and thermal phenomena in a coupled way. These studies are validated by electrical measurements regarding I-V characteristics and also by optic measurements using micro-Raman spectroscopy.
  • Keywords
    III-V semiconductors; Raman spectroscopy; aluminium compounds; gallium compounds; wide band gap semiconductors; AlGaN; electrical measurements; gateless heterostructures; micro-Raman spectroscopy; optic measurements; physical thermal model; self-heating effect; transmission line model; Aluminum gallium nitride; Electric variables measurement; Gallium nitride; Heating; Lattices; Power generation; Power transmission lines; Temperature; Thermal degradation; Transmission line measurements;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Integrated Circuit Conference, 2007. EuMIC 2007. European
  • Conference_Location
    Munich
  • Print_ISBN
    978-2-87487-002-6
  • Type

    conf

  • DOI
    10.1109/EMICC.2007.4412658
  • Filename
    4412658