Title :
Fine pitch (45 micron) P4 probing
Author :
Ishii, Toshinori ; Yoshida, Hideaki
Author_Institution :
Mitsubishi Mater. Corp., Hyogo, Japan
Abstract :
We describe the P4 (photolithographic pattern plating process) probe card. This technology has enabled very fine (45 micron) pitch, high pin count (more than 1000 pins) and high speed (>2 GHz) probing. We summarize the design, the manufacturing process, standard specifications and performance properties of the P4 probe card. The results of contact tests are also described
Keywords :
chip scale packaging; electroplating; fine-pitch technology; integrated circuit testing; lead bonding; photolithography; production testing; 45 micron; HF performance; P4 probe card; contact tests; fine pitch P4 probing; high pin count; high speed probing; manufacturing process; performance properties; photolithographic pattern plating process; standard specifications; wire bonding; Assembly; Clamps; Contacts; Joining processes; Manufacturing processes; Nickel alloys; Probes; Process design; Testing; Wafer bonding;
Conference_Titel :
Test Conference, 1998. Proceedings., International
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-5093-6
DOI :
10.1109/TEST.1998.743163
