Title :
A study on the fabrication and characterization of alumina electrostatic chuck for silicon wafer processing
Author :
Jeong, K.J. ; Spoutai, S. ; Choi, S.H. ; Cho, T.Y. ; Chun, H.-G.
Author_Institution :
Sch. of Mater. Sci. & Metall. Eng., Ulsan Univ., South Korea
Abstract :
Alumina electrostatic chucks for silicon wafer processing with wide range of electrical resistivity were fabricated by controlling the content of TiO2 in alumina (0 wt%, 1.3 wt%, 2 wt%, and 2.8 wt%). The dependence of electrostatic force on applied voltage, temperature and humidity was investigated. In addition, response characteristics on applied voltage and relationship between electrical resistivity and electrostatic force characteristics such as Coulomb force and Johnsen-Rahbeck force were discussed
Keywords :
alumina; electrical resistivity; electroplating; electrostatic devices; sample holders; semiconductor technology; Al2O3; Al2O3-TiO2; Coulomb force; Johnsen-Rahbeck force; alumina electrostatic chuck; applied voltage dependence; electrostatic force; fabrication; humidity dependence; response characteristics; response time; silicon wafer processing; temperature dependence; titania content control; wafer holder; wide electrical resistivity range; Clamps; Conductivity; Delay; Electric resistance; Electrostatics; Fabrication; Humidity; Materials science and technology; Silicon; Voltage;
Conference_Titel :
Science and Technology, 1999. KORUS '99. Proceedings. The Third Russian-Korean International Symposium on
Conference_Location :
Novosibirsk
Print_ISBN :
0-7803-5729-9
DOI :
10.1109/KORUS.1999.876219
