DocumentCode :
2524896
Title :
Digital bus faults measuring techniques
Author :
Schrift, Reuben
Author_Institution :
E&M Eng. Ltd., Ramat-Gan, Israel
fYear :
1998
fDate :
18-23 Oct 1998
Firstpage :
382
Lastpage :
387
Abstract :
This paper describes techniques available today to detect digital bus faults on electronic PCB´s using in-circuit testers. The paper will also suggest a new test technique called “CLIPS” developed using a Teradyne Z1890 ICT tester. The CLIPS uses a vector technique in which dynamic pulses are applied to the bus lines at high speed. The current pulse responses are picked up by specially designed current sensors, which are amplified and dynamically compared to pre-determined threshold levels. This technique is very fast and back-drive is very short. This makes it much safer to the board and components under test. The tests are run with different bus devices which enabled, at different threshold levels and different “expect” values, to find and diagnose the respective fault. The CLIPS uses specially designed current sensors and amplifier circuits, which perform a differentiation followed by an integration function. This makes the measurements much less sensitive to noise, voltage polarity, and current drift and temperature changes. In concept this technique can be applied to any make of Digital In-Circuit tester
Keywords :
automatic testing; built-in self test; fault diagnosis; logic testing; system buses; CLIPS test technique; amplifier circuits; crosstalk effect; current pulse responses; current sensors; differentiation; digital bus faults; dynamic pulses; electronic PCB; fault detection; fault measuring techniques; high impedance shorts detection; in-circuit testers; integration function; open pins; stuck buses; timing diagram; vector technique; Circuit faults; Circuit noise; Circuit testing; Current measurement; Electronic equipment testing; Fault detection; Integrated circuit measurements; Noise measurement; Pulse amplifiers; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Test Conference, 1998. Proceedings., International
Conference_Location :
Washington, DC
ISSN :
1089-3539
Print_ISBN :
0-7803-5093-6
Type :
conf
DOI :
10.1109/TEST.1998.743177
Filename :
743177
Link To Document :
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