• DocumentCode
    2525041
  • Title

    Microelectromechanical systems (MEMS) tutorial

  • Author

    Gabriel, Kaigham J.

  • Author_Institution
    Carnegie Mellon Univ., Pittsburgh, PA, USA
  • fYear
    1998
  • fDate
    18-23 Oct 1998
  • Firstpage
    432
  • Lastpage
    441
  • Abstract
    Using the fabrication techniques and materials of microelectronics as a basis, MEMS processes construct both mechanical and electrical components. Mechanical components in MEMS, like transistors in microelectronics, have dimensions that are measured in microns and numbers measured from a few to millions. MEMS is not about any one single application or device, nor is it defined by a single fabrication process or limited to a few materials. More than anything else, MEMS is a fabrication approach that conveys the advantages of miniaturization, multiple components and microelectronics to the design and construction of integrated electromechanical systems. MEMS devices have applications in areas ranging from automobiles and telecom switching to printers and inertial guidance systems. While MEMS devices will be a relatively small fraction of the cost, size and weight of these systems, MEMS will be critical to their operation, reliability and affordability. MEMS devices, and the smart products they enable, will increasingly be the performance differentiator for a wide variety of commercial products
  • Keywords
    micromachining; micromechanical devices; reviews; MEMS tutorial; applications; fabrication techniques; inertial navigation units; integrated electromechanical systems; market forecast; micromachining; miniaturization; multiple components; reliability; smart products; technology trends; Automobiles; Automotive materials; Electromechanical systems; Fabrication; Mechanical variables measurement; Microelectromechanical devices; Microelectromechanical systems; Microelectronics; Micromechanical devices; Tutorial;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 1998. Proceedings., International
  • Conference_Location
    Washington, DC
  • ISSN
    1089-3539
  • Print_ISBN
    0-7803-5093-6
  • Type

    conf

  • DOI
    10.1109/TEST.1998.743183
  • Filename
    743183