Title :
Design challenges and solutions for ultra-high-density monolithic 3D ICs
Author :
Panth, S. ; Samal, S. ; Yun Seop Yu ; Sung Kyu Lim
Author_Institution :
Dept. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
Monolithic 3D ICs (M3D) are an emerging technology that offers an ultra-high-density 3D integration due to the extremely small size of monolithic inter-tier vias. We explore various design styles available in M3D and present design techniques to obtain GDSII-level signoff quality results for each of these styles. We also discuss various challenges facing each style and provide solutions to them.
Keywords :
SRAM chips; integrated circuit design; three-dimensional integrated circuits; transistor circuits; GDSII-level signoff quality; block-level monolithic 3D ICs; gate-level monolithic 3D ICs; monolithic 3D SRAM; monolithic intertier vias; transistor-level monolithic 3D ICs; ultrahigh-density monolithic 3D ICs; Integrated circuit modeling; Logic gates; MOS devices; Metals; Random access memory; Standards; Three-dimensional displays;
Conference_Titel :
SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), 2014 IEEE
Conference_Location :
Millbrae, CA
DOI :
10.1109/S3S.2014.7028195
