DocumentCode
2525085
Title
A numerical analysis of the effects of the packing of microstrip devices with photonic bandgap technique
Author
Zhiyuan Yu ; Weigan Lin
Author_Institution
Univ. of Electron. Sci. & Technol. of China, Chengdu, China
fYear
2002
fDate
26-26 Sept. 2002
Firstpage
277
Lastpage
278
Abstract
A numerical analysis is presented by the finite difference time domain method in this paper. A microstrip with an asymmetric metal bandgap structure which shows an extra-wide stop band is numerically analysed when its package is changed.
Keywords
finite difference time-domain analysis; microstrip components; microwave photonics; packaging; photonic band gap; asymmetric metal bandgap structure; extra-wide stop band; finite difference time domain method; microstrip devices; package; photonic bandgap technique; Etching; Finite difference methods; Frequency; Microstrip; Microwave devices; Numerical analysis; Optical filters; Packaging; Photonic band gap; Time domain analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Infrared and Millimeter Waves, 2002. Conference Digest. Twenty Seventh International Conference on
Conference_Location
San Diego, CA, USA
Print_ISBN
0-7803-7423-1
Type
conf
DOI
10.1109/ICIMW.2002.1076192
Filename
1076192
Link To Document