• DocumentCode
    2525116
  • Title

    Self-Aligned LOCOS/Trench (SALOT) combination isolation technology planarized by chemical mechanical polishing

  • Author

    Park, T. ; Ahn, S.J. ; Ko, J.H. ; Hong, C.G. ; Kim, J.D. ; Ahn, S.T. ; Lee, M.Y.

  • Author_Institution
    Samsung Electron. Co. Ltd., Kyungki-Do, South Korea
  • fYear
    1994
  • fDate
    11-14 Dec. 1994
  • Firstpage
    675
  • Lastpage
    678
  • Abstract
    A novel isolation technology of Self-Aligned LOCOS/Trench (SALOT) has been developed for the isolation of deep-sub micron devices. SALOT has the isolation structure of a Poly-Buffered LOCOS (PBL) field oxide and a self-aligned trench at the center of a narrow field region planarized by the Chemical Mechanical Polishing (CMP) process. With SALOT, dishing was effectively suppressed for field regions as wide as 4 mm. Devices with SALOT show excellent isolation characteristics and gate oxide quality, and low leakage currents. SALOT can be scaled down to the 1 Gbit DRAM generation.<>
  • Keywords
    DRAM chips; MOS memory circuits; integrated circuit technology; isolation technology; leakage currents; polishing; 1 Gbit; 4 mm; DRAM; MOS process; SALOT; chemical mechanical polishing; deep-sub micron devices; gate oxide quality; isolation technology; leakage currents; narrow field region; poly-buffered LOCOS; self-aligned LOCOS/trench technology; Anisotropic magnetoresistance; Chemical technology; Chemical vapor deposition; Etching; Isolation technology; Lithography; Planarization; Random access memory; Shape; Silicon compounds;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1994. IEDM '94. Technical Digest., International
  • Conference_Location
    San Francisco, CA, USA
  • ISSN
    0163-1918
  • Print_ISBN
    0-7803-2111-1
  • Type

    conf

  • DOI
    10.1109/IEDM.1994.383291
  • Filename
    383291