Title :
Microstructural and compositional failure analysis of Cr-CrCu-Cu thin films for ball grid array (BGA) applications
Author :
Zhang, Na ; McNicholas, Mark ; Colvin, Neil
Author_Institution :
Appl. Lab., EDAX Int., Mahwah, NJ, USA
Abstract :
A PVD Cr-CrCu-Cu metal scheme for flip chip applications was investigated varying the conditions of deposition power and temperature, and film thickness. The thin film stress and resistivity of the Cr-CrCu-Cu multilayers and the effect of film and thermal cycle reliability were studied. Thermal cycle reliability results proved to be a function of both the CrCu alloy and the Cu overlayer thickness. Analytical Electron Microscopy (AEM) results support the diffusion barrier relationship of CrCu layer
Keywords :
chromium; chromium alloys; copper; copper alloys; diffusion barriers; electrical resistivity; failure analysis; flip-chip devices; integrated circuit packaging; integrated circuit reliability; internal stresses; mechanical strength; metallisation; scanning electron microscopy; shear strength; sputter deposition; sputtered coatings; thermal stresses; transmission electron microscopy; BGA applications; Cr-CrCu-Cu; Cr-CrCu-Cu multilayers; Cr-CrCu-Cu thin films; CrCu alloy thickness; Cu overlayer thickness; PVD Cr-CrCu-Cu metal scheme; SEM; TEM; analytical electron microscopy; ball grid array; compositional failure analysis; deposition power variation; diffusion barrier relationship; film reliability; film thickness variation; flip chip applications; microstructural failure analysis; resistivity; sputter deposition; temperature variation; thermal cycle reliability; thin film stress; Atherosclerosis; Conductivity; Copper alloys; Failure analysis; Flip chip; Nonhomogeneous media; Temperature; Thermal resistance; Thermal stresses; Transistors;
Conference_Titel :
Physical & Failure Analysis of Integrated Circuits, 1997., Proceedings of the 1997 6th International Symposium on
Print_ISBN :
0-7803-3985-1
DOI :
10.1109/IPFA.1997.638119
