Title :
Thermomechanical factors in molybdenum field emitter operation and failure
Author_Institution :
Naval Res. Lab., Washington, DC, USA
Abstract :
A thermomechanical analysis of many of the basic effects which might be expected to play a role in field emitter array breakdown is given. We find that of the "intrinsic" factors considered only the large Maxwell stresses induced by the electric field might possibly lead to failure. Direct thermal effects are always insignificant. Failure modes associated with "extrinsic" phenomena such as arcing or from tip "imperfections" such as grain boundaries have not been studied and these may also be important.<>
Keywords :
molybdenum; semiconductor device reliability; stress effects; vacuum microelectronics; Mo; arcing; direct thermal effects; electric field; failure; failure modes; field emitter array breakdown; grain boundaries; intrinsic factors; large Maxwell stresses; molybdenum field emitter operation; thermomechanical analysis; thermomechanical factors; Electric breakdown; Equations; Field emitter arrays; Finite element methods; Geometry; Laboratories; Temperature; Thermal conductivity; Thermal stresses; Thermomechanical processes;
Conference_Titel :
Electron Devices Meeting, 1994. IEDM '94. Technical Digest., International
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-2111-1
DOI :
10.1109/IEDM.1994.383302
