DocumentCode :
252547
Title :
In depth characterization of hole transport in 14nm FD-SOI pMOS devices
Author :
Shin, M. ; Shi, M. ; Mouis, M. ; Cros, A. ; Josse, E. ; Kim, G.T. ; Ghibaudo, G.
Author_Institution :
IMEP-LAHC, Grenoble INP, Grenoble, France
fYear :
2014
fDate :
6-9 Oct. 2014
Firstpage :
1
Lastpage :
2
Abstract :
In this paper, we studied hole transport in highly scaled (down to 14nm-node) FDSOI devices, from 77K to 300K in the coupling condition. We studied mobility enhancement by Ge% and back biasing. Then, mobility degradation in short channel devices was intensively analysed and additional scattering mechanisms were revealed in terms of their origin and location.
Keywords :
MIS devices; silicon-on-insulator; FD-SOI pMOS devices; back biasing; coupling condition; hole transport; mobility enhancement; scattering mechanisms; short channel devices degradation; size 14 nm; temperature 77 K to 300 K; Couplings; High K dielectric materials; Logic gates; MOS devices; Phonons; Scattering; Silicon germanium;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), 2014 IEEE
Conference_Location :
Millbrae, CA
Type :
conf
DOI :
10.1109/S3S.2014.7028215
Filename :
7028215
Link To Document :
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