• DocumentCode
    2525515
  • Title

    Two dimensional magnetic and thermal analysis of high speed switched reluctance motor using soft magnetic composite material

  • Author

    Vijayakumar, K. ; Karthikeyan, R. ; Sathishkumar, G.K. ; Arumugam, R.

  • Author_Institution
    ITC InfoTech, Bangalore
  • fYear
    2008
  • fDate
    19-21 Nov. 2008
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    In aircraft electric motor driven fuel delivery system, the motor must be characterized by high power density, reliability, less size, less weight and high speed. The high speed operation, fault tolerance, high power density makes switched reluctance motor an ideal candidate for high speed aerospace applications. This paper investigates the application potential of soft magnetic composite material (SOMALOY 500) in high-speed switched reluctance motor. Two configurations (1) all sheet metal (2) all Soft magnetic composite have been studied using finite element analysis to obtain their magnetic and thermal characteristics. The study reveals that the all soft magnetic composite configuration albeit suffers from poor average torque, digress in torque-to-weight ratio from conventional model is not very much and the temperature distribution estimation reveals that the all soft magnetic composite model has better thermal capabilities which makes it a viable alternative in high speed aerospace applications.
  • Keywords
    electric motors; finite element analysis; reluctance motors; soft magnetic materials; fault tolerance; finite element analysis; high speed switched reluctance motor; power density; soft magnetic composite material; temperature distribution estimation; thermal analysis; torque ripple; Aircraft; Composite materials; Electric motors; Fault tolerance; Fuels; Magnetic analysis; Magnetic switching; Power system reliability; Reluctance motors; Soft magnetic materials; Finite element analysis; Inductance profile; Soft magnetic composite (SMC); Switched reluctance motor (SRM); Torque ripple;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    TENCON 2008 - 2008 IEEE Region 10 Conference
  • Conference_Location
    Hyderabad
  • Print_ISBN
    978-1-4244-2408-5
  • Electronic_ISBN
    978-1-4244-2409-2
  • Type

    conf

  • DOI
    10.1109/TENCON.2008.4766454
  • Filename
    4766454