Title :
Flip-chip mounted 1:4 demultiplexer IC in InP DHBT technology operating up to 100 Gb/s
Author :
Kärnfelt, Camilla ; Hallin, Joakim ; Kjellberg, Torgil ; Hansson, Bertil ; Swahn, Thomas
Author_Institution :
Chalmers Univ. of Technol., Goteborg
Abstract :
Operation of a packaged 1:4 demultiplexer (DEMUX) in InP DHBT technology for an input data rate of up to 100 Gb/s is presented. The DEMUX IC is flip-chip mounted in a microwave package consisting of an aluminum nitride substrate with coplanar waveguides placed in a Kovar/MoCu housing with coaxial V-connectors. The DEMUX was operated at a supply voltage of -3.5 V and consumes 2.1 W.
Keywords :
III-V semiconductors; bipolar MMIC; coaxial waveguides; coplanar waveguides; demultiplexing equipment; flip-chip devices; heterojunction bipolar transistors; indium compounds; integrated circuit packaging; semiconductor device packaging; DEMUX IC; DHBT technology; InP; bit rate 100 Gbit/s; coaxial V-connectors; coplanar waveguides; flip-chip mounted demultiplexer; microwave package; power 2.1 W; substrate; voltage -3.5 V; Aluminum nitride; Assembly; Clocks; Conducting materials; DH-HEMTs; Indium phosphide; Integrated circuit packaging; Integrated circuit technology; Microwave integrated circuits; Microwave technology;
Conference_Titel :
Microwave Integrated Circuit Conference, 2007. EuMIC 2007. European
Conference_Location :
Munich
Print_ISBN :
978-2-87487-002-6
DOI :
10.1109/EMICC.2007.4412714
