• DocumentCode
    252563
  • Title

    Mixed-single well 8T SRAM bitcell for wide voltage range in 28nm FDSOI

  • Author

    Makosiej, A. ; Planes, N. ; Ranica, R. ; Ciampolini, L. ; Thomas, O.

  • Author_Institution
    LETI, Univ. Grenoble Alpes, Grenoble, France
  • fYear
    2014
  • fDate
    6-9 Oct. 2014
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    Enabling high speed SRAM operation at low voltage is typically limited by variability and low device drivability. Most of the reported low-voltage SRAM bitcells show significant area penalty and low performances. This paper proposes a Mixed-Single Well (MSW) 8T SRAM bitcell, which takes advantage of wide back bias voltage range capability of ultra-thin body and box (UTBB) FD-SOI technology The bitcell is evaluated in 28nm using the read-after-write (RAW) dynamic metric which overcomes the limitations of standard readability (RA) and writeability (WA) approaches. It is demonstrated that body biasing tuning enables operation of the proposed bitcell at approx. 5.6s at 0.4V with over 100MHz.
  • Keywords
    SRAM chips; elemental semiconductors; silicon-on-insulator; MSW 8T SRAM bitcell; RAW dynamic metric; back bias voltage range capability; body biasing tuning; device drivability; high-speed SRAM operation; low-voltage SRAM bitcells; mixed-single-well 8T SRAM bitcell; read-after-write dynamic metric; size 28 nm; standard readability approach; ultrathin-body-and-box FDSOI technology; voltage 0.4 V; voltage range; writeability approach; Discharges (electric); Dynamics; Performance evaluation; Random access memory; Standards; Tuning;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), 2014 IEEE
  • Conference_Location
    Millbrae, CA
  • Type

    conf

  • DOI
    10.1109/S3S.2014.7028223
  • Filename
    7028223