DocumentCode
252563
Title
Mixed-single well 8T SRAM bitcell for wide voltage range in 28nm FDSOI
Author
Makosiej, A. ; Planes, N. ; Ranica, R. ; Ciampolini, L. ; Thomas, O.
Author_Institution
LETI, Univ. Grenoble Alpes, Grenoble, France
fYear
2014
fDate
6-9 Oct. 2014
Firstpage
1
Lastpage
2
Abstract
Enabling high speed SRAM operation at low voltage is typically limited by variability and low device drivability. Most of the reported low-voltage SRAM bitcells show significant area penalty and low performances. This paper proposes a Mixed-Single Well (MSW) 8T SRAM bitcell, which takes advantage of wide back bias voltage range capability of ultra-thin body and box (UTBB) FD-SOI technology The bitcell is evaluated in 28nm using the read-after-write (RAW) dynamic metric which overcomes the limitations of standard readability (RA) and writeability (WA) approaches. It is demonstrated that body biasing tuning enables operation of the proposed bitcell at approx. 5.6s at 0.4V with over 100MHz.
Keywords
SRAM chips; elemental semiconductors; silicon-on-insulator; MSW 8T SRAM bitcell; RAW dynamic metric; back bias voltage range capability; body biasing tuning; device drivability; high-speed SRAM operation; low-voltage SRAM bitcells; mixed-single-well 8T SRAM bitcell; read-after-write dynamic metric; size 28 nm; standard readability approach; ultrathin-body-and-box FDSOI technology; voltage 0.4 V; voltage range; writeability approach; Discharges (electric); Dynamics; Performance evaluation; Random access memory; Standards; Tuning;
fLanguage
English
Publisher
ieee
Conference_Titel
SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), 2014 IEEE
Conference_Location
Millbrae, CA
Type
conf
DOI
10.1109/S3S.2014.7028223
Filename
7028223
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