DocumentCode
2525641
Title
Temperature and process compensated clock generator using feedback TPC bias
Author
Lee, Tzung-Je ; Shmilovitz, Doron ; Hsieh, Yi-Jie ; Wang, Chua-Chin
Author_Institution
Cheng Shiu Univ., Kaohsiung, Taiwan
fYear
2012
fDate
May 30 2012-June 1 2012
Firstpage
1
Lastpage
4
Abstract
This paper proposes a temperature and process compensated clock generator using a feedback TPC (temperature and process compensation) bias circuit. With the proposed feedback TPC bias based on the OPA, MOS transistors and resistors, the BJT required in traditional bandgap bias circuit could be avoided. Thus, it is easy to be integrated with less area penalty. The proposed design is implemented using 0.25μm BCD process. According to the all-corners simulation results, the proposed clock generator processes the frequency diffusion error of 2.10% in the worst cases. Besides, the worst case duty cycle is simulated to be 48.93.%. The area of the chip is 0.1356 mm2.
Keywords
MOSFET; circuit feedback; circuit simulation; clocks; resistors; temperature; BCD process; BJT; MOS transistor; OPA; all-corners simulation; bandgap bias circuit; feedback TPC bias circuit; frequency diffusion error; process compensated clock generator; resistor; size 0.25 mum; temperature; Clocks; Delay; Generators; Regulators; Ring oscillators; Temperature sensors; Clock generator; compensation; process; temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
IC Design & Technology (ICICDT), 2012 IEEE International Conference on
Conference_Location
Austin, TX
ISSN
pending
Print_ISBN
978-1-4673-0146-6
Electronic_ISBN
pending
Type
conf
DOI
10.1109/ICICDT.2012.6232863
Filename
6232863
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