• DocumentCode
    2525641
  • Title

    Temperature and process compensated clock generator using feedback TPC bias

  • Author

    Lee, Tzung-Je ; Shmilovitz, Doron ; Hsieh, Yi-Jie ; Wang, Chua-Chin

  • Author_Institution
    Cheng Shiu Univ., Kaohsiung, Taiwan
  • fYear
    2012
  • fDate
    May 30 2012-June 1 2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper proposes a temperature and process compensated clock generator using a feedback TPC (temperature and process compensation) bias circuit. With the proposed feedback TPC bias based on the OPA, MOS transistors and resistors, the BJT required in traditional bandgap bias circuit could be avoided. Thus, it is easy to be integrated with less area penalty. The proposed design is implemented using 0.25μm BCD process. According to the all-corners simulation results, the proposed clock generator processes the frequency diffusion error of 2.10% in the worst cases. Besides, the worst case duty cycle is simulated to be 48.93.%. The area of the chip is 0.1356 mm2.
  • Keywords
    MOSFET; circuit feedback; circuit simulation; clocks; resistors; temperature; BCD process; BJT; MOS transistor; OPA; all-corners simulation; bandgap bias circuit; feedback TPC bias circuit; frequency diffusion error; process compensated clock generator; resistor; size 0.25 mum; temperature; Clocks; Delay; Generators; Regulators; Ring oscillators; Temperature sensors; Clock generator; compensation; process; temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    IC Design & Technology (ICICDT), 2012 IEEE International Conference on
  • Conference_Location
    Austin, TX
  • ISSN
    pending
  • Print_ISBN
    978-1-4673-0146-6
  • Electronic_ISBN
    pending
  • Type

    conf

  • DOI
    10.1109/ICICDT.2012.6232863
  • Filename
    6232863