Title :
3D modeling of rapid thermal processors for design optimization of a new flexible RTP system
Author :
Yunzhong Chen ; Booth, L. ; Schaper, C. ; Khuri-Yakub, B.T. ; Saraswat, K.C.
Author_Institution :
Dept. of Electr. Eng., Stanford Univ., CA, USA
Abstract :
A "virtual reactor" methodology for optimal design of a rapid thermal processor (RTP) to obtain the best possible wafer temperature uniformity is described in this paper. Given the equipment configuration, e.g., the lamp array, a three-dimensional simulator is used to predict the wafer temperature profiles for various lamp array designs for different processing conditions. The only experimental input needed is the spatial light flux distribution of the individual tungsten-halogen bulb which forms the lamp array. The simulations show that the flux distribution of the heating source significantly affects the temperature pattern of the wafer. Based on these results, a new RTP system with an adjustable reflector and multivariable control has been designed.<>
Keywords :
heating; multivariable control systems; power control; rapid thermal processing; semiconductor process modelling; simulation; temperature control; thermal analysis; 3D modeling; adjustable reflector; design optimization; flexible RTP system; lamp array designs; multivariable control; processing conditions; rapid thermal processors; spatial light flux distribution; temperature pattern; three-dimensional simulator; tungsten-halogen bulb; virtual reactor methodology; wafer temperature profiles; wafer temperature uniformity; Design methodology; Design optimization; Heating; Lamps; Optical arrays; Predictive models; Process design; Rapid thermal processing; Semiconductor device modeling; Temperature;
Conference_Titel :
Electron Devices Meeting, 1994. IEDM '94. Technical Digest., International
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-2111-1
DOI :
10.1109/IEDM.1994.383349
