The use of impedance spectroscopy, SEM and SAM imaging for early detection of failure in SMT assemblies

Author

Ousten, Y. ; Mejdi, S. ; Fenech, A. ; Deletage, J.Y. ; Bechou, L. ; Perichaud, M.G. ; Danto, Y.

Author_Institution

IXL, Bordeaux I Univ., Talence, France

fYear

1997

fDate

21-25 Jul 1997

Firstpage

74

Lastpage

79

Abstract

We propose complementary solutions to improve the evaluation of PCB under specific stresses using electrical and physical indicators adapted to a given part of the board. For ceramic capacitors, the residual piezoelectricity provides an impedance signature at resonance allowing detection of local physical defects. Solder joint fatigue criticity under thermal cycle can be predicted using combined analytical and FEM simulations, while the lead phases coarsening provides a good early degradation indicator. At last, ball inspection of BGA packages using shear waves in scanning acoustic microscope lead to an interesting improvement of resolution

Keywords

acoustic microscopy; ceramic capacitors; electric impedance measurement; failure analysis; finite element analysis; printed circuit testing; scanning electron microscopy; soldering; surface mount technology; BGA package; FEM simulation; PCB; SAM imaging; SEM imaging; SMT assembly; ball inspection; ceramic capacitor; defect detection; failure detection; impedance spectroscopy; lead phase coarsening; residual piezoelectricity; shear wave; solder joint fatigue; thermal cycling; Capacitors; Ceramics; Electrochemical impedance spectroscopy; Lead; Numerical analysis; Piezoelectricity; Residual stresses; Resonance; Scanning electron microscopy; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Physical & Failure Analysis of Integrated Circuits, 1997., Proceedings of the 1997 6th International Symposium on

Print_ISBN

0-7803-3985-1

Type

conf

DOI

10.1109/IPFA.1997.638124

Filename

638124