Title :
Novel optical probing technique for flip chip packaged microprocessors
Author :
Paniccia, Mario ; Eiles, Travis ; Rao, V.R.M. ; Yee, Wai Mun
Author_Institution :
Intel Corp., Santa Clara, CA, USA
Abstract :
A novel infrared (IR) optical probing technique which provides fast and direct access to diffusion (p-n junction) nodes directly through the silicon substrate is described. The optical probing technology allows waveform measurements to be obtained directly from internal nodes of a CMOS integrated circuit (IC). These measurements can be made on C4 (Flip Chip) mounted ICs in stand-alone, MCM or any other package type for which the chip backside is accessible and the silicon substrate can be thinned. Timing waveforms taken from state of the art Intel microprocessors running at core frequencies >400 MHz using this IR probing technique have been obtained and are presented
Keywords :
CMOS digital integrated circuits; flip-chip devices; integrated circuit testing; microprocessor chips; probes; timing; waveform analysis; C4; CMOS integrated circuit; IR probing; Intel microprocessors; Si; chip backside; core frequencies; diffusion nodes; flip chip packaged microprocessors; internal nodes; optical probing technique; p-n junction nodes; timing waveforms; waveform measurements; CMOS integrated circuits; CMOS technology; Flip chip; Integrated circuit measurements; Integrated circuit packaging; Integrated circuit technology; Integrated optics; P-n junctions; Semiconductor device measurement; Silicon;
Conference_Titel :
Test Conference, 1998. Proceedings., International
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-5093-6
DOI :
10.1109/TEST.1998.743255
